JPS622778Y2 - - Google Patents
Info
- Publication number
- JPS622778Y2 JPS622778Y2 JP17561682U JP17561682U JPS622778Y2 JP S622778 Y2 JPS622778 Y2 JP S622778Y2 JP 17561682 U JP17561682 U JP 17561682U JP 17561682 U JP17561682 U JP 17561682U JP S622778 Y2 JPS622778 Y2 JP S622778Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing layer
- thermal expansion
- substrate
- synthetic resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000003463 adsorbent Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17561682U JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17561682U JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5981040U JPS5981040U (ja) | 1984-05-31 |
| JPS622778Y2 true JPS622778Y2 (en]) | 1987-01-22 |
Family
ID=30382024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17561682U Granted JPS5981040U (ja) | 1982-11-22 | 1982-11-22 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981040U (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2796043B2 (ja) * | 1993-07-30 | 1998-09-10 | 京セラ株式会社 | 電子部品 |
| JP2014116409A (ja) * | 2012-12-07 | 2014-06-26 | Denso Corp | 電子装置 |
-
1982
- 1982-11-22 JP JP17561682U patent/JPS5981040U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5981040U (ja) | 1984-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2712618B2 (ja) | 樹脂封止型半導体装置 | |
| KR100268610B1 (en) | Semiconductor device and manufacturing method thereof | |
| CN108604589A (zh) | 半导体装置及其制造方法 | |
| JPS622778Y2 (en]) | ||
| JPH08125071A (ja) | 半導体装置 | |
| US6265768B1 (en) | Chip scale package | |
| JPS60154543A (ja) | 合成樹脂基板を用いた半導体装置 | |
| JPS59154054A (ja) | ワイヤおよびそれを用いた半導体装置 | |
| EP0893823B1 (en) | Semiconductor bonding and sealing structure | |
| JPH0337308B2 (en]) | ||
| JPH0142356Y2 (en]) | ||
| JP2002373961A (ja) | 樹脂封止型電子装置 | |
| JPS61230344A (ja) | 樹脂封止型半導体装置 | |
| JP3147157B2 (ja) | 半導体素子を含む電子回路装置 | |
| JP2555519Y2 (ja) | 表面実装樹脂封止型半導体装置 | |
| JPH0590448A (ja) | 混成集積回路 | |
| JPS6167247A (ja) | 混成集積回路 | |
| JPH0210858A (ja) | 樹脂封止型半導体装置 | |
| EP0412608A1 (en) | Semiconductor device | |
| JPS59763Y2 (ja) | 混成集積回路 | |
| JPH07273247A (ja) | 半導体装置およびその製法 | |
| JPH03155655A (ja) | チップオンボード型印刷回路板 | |
| JPS6422039A (en) | Semiconductor device | |
| CN114975135A (zh) | 一种内置元器件的封装方法 | |
| JPS60154647A (ja) | 半導体装置 |